Characteristics of silicon substrates fabricated using nanogrinding and chemo-mechanical-grinding

Materials Science and Engineering: A

Volumn 479, Issue 1-2, 2008, Pages 373-379

  Huang, H ^a   Wang, B L ^a   Wang, Y ^a   Zou, J ^a   Zhou, L ^b  

^a UNIVERSITY OF QUEENSLAND   (Australia)

^b IBARAKI UNIVERSITY   (Japan)

Author keywords

CMG; Grinding; Nanoindentation; Nanoscratch; Silicon; Subsurface damage

Indexed keywords

CHARACTERIZATION; CRYSTALLINE MATERIALS; GRINDING (MACHINING); NANOINDENTATION; PLASTIC DEFORMATION;

CHEMO-MECHANICAL-GRINDING; NANOGRINDING;

SILICON;

CHARACTERIZATION; CRYSTALLINE MATERIALS; GRINDING (MACHINING); NANOINDENTATION; PLASTIC DEFORMATION; SILICON;

EID: 40749162683     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2007.06.061     Document Type: Article

References (19)

1. Blake P.N., and Scattergood R.O. J. Am. Ceram. Soc. 73 (1990) 949-957
2. Shibata T., Fuji S., and Ikeda M. Precis. Eng. 18 (1996) 127-137
3. Yan J.W., Takahashi H., Tamaki J., and Gai X.H. Appl. Phys. Lett. 86 (2005) 1819131-1819133
4. Kunz R.R., Clark H.R., Nitishin P.M., Rothschild M., and Ahern B.S. J. Mater. Res. 11 (1996) 1228-1237
5. Zhou L., Eda H., Shimizu J., Kamiya S., Iwase H., and Kimura S. Ann. CIRP 55 1 (2006) 313-316
6. Zhou L., Kawaii S., Kimura S., Shimizu J., and Eda H. Proceedings of the 3rd International Conference on Leading Edge Manufacturing in 21st Century. Nagoya, Japan, October 19-22 (2005) 889-892
7. Zarudi I., Zou J., McBride W., and Zhang L.C. Appl. Phys. Lett. 85 (2004) 932-934
8. Zhang L.C., and Zarudi I. Int. J. Mech. Sci. 43 (2001) 1985-1996
9. Saka H., Shimatani A., Sugamura M., and Suprijadi N. Philos. Mag. A 82 (2002) 1971-1981
10. Yan J.W., Takahashi H., Gai X., Harada H., Tamaki J., and Kuriyagawa T. Mater. Sci. Eng. A 423 (2006) 19-23
11. Zarudi I., and Zhang L.C. Tribol. Int. 32 (1999) 701-712
12. Bradby J.E., Williams J.S., Wong-Leung J., Swain M.V., and Munroe P. Appl. Phys. Lett. 77 (2000) 3749-3751
13. Bradby J.E., Williams J.S., Wong-Leung J., Swain M.V., and Munroe P. J. Mater. Res. 16 (2001) 1500-1507
14. Zarudi I., and Zhang L.C. J. Mater. Process. Technol. 84 (1998) 149-158
15. Huang H. Mater. Sci. Eng. A 345 (2003) 155-163
16. Chen W.K., Kuriyagawa T., Huang H., and Yosihara N. Precis. Eng. 29 (2005) 315-323
17. Malkin S. Grinding Technology: Theory and Applications of Machining with Abrasives (1989), Ellis Horwood Ltd., Chichester
18. T.G. Bifano, Ductile-regime grinding of brittle materials, PhD Thesis, North Carolina State University, Raleigh, NC, USA, 1988.
19. Jahanmir S., Xu H.H.K., and Ives L.K. In: Jahanmir S., Ramulu M., and Koshy P. (Eds). Machining of Ceramics and Composites (1999), Marcel Dekker, New York pp. 11-84