Novel method to investigate the critical depth of cut of ground silicon wafer

Journal of Materials Processing Technology

Volumn 182, Issue 1-3, 2007, Pages 157-162

  Young, H T ^a   Liao, Hsi Tien ^a   Huang, Hong Yi ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

Critical depth; Ductile regime; Grinding; Polishing; Silicon wafer; Subsurface damage

Indexed keywords

DUCTILITY; ETCHING; GRINDING (MACHINING); PARAMETER ESTIMATION; POLISHING; SURFACE ROUGHNESS; SURFACE TREATMENT;

CRITICAL DEPTH; DUCTILE REGIME; GRINDING; SUBSURFACE DAMAGE;

SILICON WAFERS;

EID: 33750634167     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2006.07.025     Document Type: Article

References (10)

1. Huang N.P., and Fu Y.Q. Effect of crystalline orientation in the ductile regime machining. Int. J. Adv. Manuf. Technol. 16 (2000) 871-876
2. Malkin S., and Hwang T.W. Grinding mechanisms for ceramics. Ann. CIRP 45 (1996) 569-580
3. Blake P., and Scattergood R.O. Ductile regime machining of germanium and silicon. J. Am. Ceram. Soc. 73 (1990) 949-957
4. Domnich V., and Gogotsi Y. Phase Transformations in Silicon Under Contact Loading (2002), Advanced Study Center Co. Ltd.
5. Gogotsi Y., Zhou G., Ku S.S., and Cetinkunt S. Raman microspectroscopy analysis of pressure induced metallization in scratching of silicon. Semicond. Sci. Technol. 16 (2001) 345-352
6. Shibata T., Fujii S., Makino E., and Ikeda M. Ductile regime turning mechanism of single crystal silicon. Precision Eng. 18 (1996) 129-137
7. Bifano T.G., Dow T.A., and Scattergood R.O. Ductile regime grinding: a new technology for machining brittle materials. J. Eng. Ind., Trans. ASME 113 (1991) 184-189
8. Sharp K.W., Miller M.H., and Scattergood R.O. Analysis of the grain depth of cut in plunge grinding. J. Int. Soc. Precision Eng. Nanotechnol. 24 (2000) 220-230
9. Puttick K.E., Rudman M.R., Smith F.A., and Lindsey K. Single point diamond machining of glasses. Proc. Roy. Soc. A 426 (1989) 19-30
10. D.B. Marshall, R. Lawn, Indentation of Brittle Materials, Microindentation Tech. in Materials Science and Engineering, ASTM STP 889, 1986.