Material removal mechanism of chemo-mechanical grinding (CMG) of Si wafer by using soft abrasive grinding wheel (SAGW)

Key Engineering Materials

Volumn 389-390, Issue , 2009, Pages 459-464

  Guo, D M ^a   Tian, Y B ^a,b   Kang, R K ^a   Zhou, L ^b   Lei, M K ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

^b IBARAKI UNIVERSITY   (Japan)

Author keywords

CMG; Mechanism; SAGW; Silicon wafers; Ultra precision grinding; XPS

Indexed keywords

GRINDING MACHINES; GRINDING WHEELS; MECHANISMS; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS; SURFACE ROUGHNESS; TOPOGRAPHY; TRANSMISSION ELECTRON MICROSCOPY; WHEELS; X RAY PHOTOELECTRON SPECTROSCOPY;

CHEMO-MECHANICAL-GRINDING; CROSS-SECTION TRANSMISSION; DAMAGE-FREE SURFACES; GENERATION PRINCIPLES; GRINDING PERFORMANCE; MATERIAL REMOVAL MECHANISMS; SAGW; ULTRAPRECISION GRINDING;

GRINDING (MACHINING);

EID: 58149095808     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: None     Document Type: Article

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