Research on chemo-mechanical-grinding (CMC) of Si wafer - 1st report: Development of CMG wheel;Research on chemo-mechanical-grinding (CMC) of Si wafer - 1st report: Development of CMG wheel

Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering

Volumn 68, Issue 12, 2002, Pages 1559-1563

  Zhou, Libo ^a   Kawai, Shinji ^a   Honda, Masayuki ^a   Shimizu, Jun ^a   Eda, Hiroshi ^a   Yakita, Kazuaki ^a  

^a NONE

Author keywords

Abrasive; Additives; Chemo Mechanical Grinding (cmg); Pattern dependency; Silicon wafer; Subsurface damage

Indexed keywords

ABRASIVES; ADDITIVES; CRACKS; GRINDING (MACHINING); PLASTICITY;

CHEMO-MECHANICAL-GRINDING (CMG); PATTERN DEPENDENCY; SUBSURFACE DAMAGE;

SILICON WAFERS;

EID: 28844451379     PISSN: 09120289     EISSN: None     Source Type: Journal    
DOI: 10.2493/jjspe.68.1559     Document Type: Article

References (0)