Characterization of ELID grinding process for machining silicon wafers

Journal of Materials Processing Technology

Volumn 198, Issue 1-3, 2008, Pages 281-290

  Islam, M M ^a   Kumar, A Senthil ^a   Balakumar, S ^b   Lim, H S ^a   Rahman, M ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

ELID grinding; Grinding performance; Machining silicon wafers; Self sharpening ability

Indexed keywords

GRINDING (MACHINING); GRINDING WHEELS; MICROELECTRONICS;

ELECTROLYTIC IN-PROCESS DRESSING (ELID); GRINDING PERFORMANCE; MACHINING SILICON WAFERS;

SILICON WAFERS;

EID: 37449017128     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2007.06.077     Document Type: Article

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