ELID grinding of silicon wafers: A literature review

International Journal of Machine Tools and Manufacture

Volumn 47, Issue 3-4, 2007, Pages 529-536

  Liu, J H ^a   Pei, Z J ^a   Fisher, Graham R ^b  

^a Kansas State University   (United States)

^b MEMC Electronic Materials Inc   (United States)

Author keywords

Electrolytic in process dressing; Grinding; Machining; Semiconductor material; Silicon wafer

Indexed keywords

GRINDING (MACHINING); INTEGRATED CIRCUITS; SEMICONDUCTOR MATERIALS; WHEEL DRESSING;

ELECTROLYTIC IN-PROCESS DRESSING (ELID); TECHNICAL BARRIERS;

SILICON WAFERS;

EID: 33845452723     PISSN: 08906955     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijmachtools.2006.06.001     Document Type: Article

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