Thermal stability study of Cu(MoN x ) seed layer on barrierless Si

Journal of Electronic Materials

Volumn 38, Issue 1, 2009, Pages 100-107

  Chu, J P ^a   Lin, C H ^b   Leau, W K ^c   John, V S ^a,d  

^a NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

^b CHIN MIN INSTITUTE OF TECHNOLOGY   (Taiwan)

^c NATIONAL TAIWAN OCEAN UNIVERSITY   (Taiwan)

^d TDMNS College   (India)

Author keywords

Barrierless metallization; Copper film; Seed layer

Indexed keywords

BARRIERLESS METALLIZATION; COPPER FILM; COPPER SILICIDES; CU FILMS; DETRIMENTAL REACTIONS; ELECTRICAL RESISTIVITIES; FOCUSED ION BEAM MICROSCOPIES; POTENTIAL APPLICATIONS; REACTION LAYERS; SEED LAYER; SI SUBSTRATES; THERMAL PERFORMANCES; THERMAL STABILITIES; THICK REACTION LAYERS; TRACE AMOUNTS; X-RAY DIFFRACTIONS;

ANNEALING; ELECTRIC RESISTANCE; METALLIC FILMS; METALLIZING; MOLYBDENUM; SILICIDES; SILICON; SPUTTER DEPOSITION; THERMODYNAMIC STABILITY;

COPPER;

EID: 57649225891     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-008-0523-3     Document Type: Conference Paper

References (20)

1. S.M. Rossnage T.S. Kuan 2004 J. Vac. Sci. Technol. B 22 240
2. W.H. Lee B.S. Cho B.J. Kang H.J. Yang J.G. Lee I.K. Woo S.W. Lee J. Jang G.S. Chae H.S. Soh 2001 Appl. Phys. Lett. 79 3962
3. J.P. Chu T.N. Lin 1999 J. Appl. Phys. 85 6462
4. C.H. Lin J.P. Chu T. Mahalingam T.N. Lin S.F. Wang 2003 J. Mater. Res. 18 1429
5. C.H. Lin J.P. Chu T. Mahalingam T.N. Lin S.F. Wang 2003 J. Electron. Mater. 32 1235
6. C.J. Liu J.S. Chen 2002 Appl. Phys. Lett. 80 2678
7. J. Koike M. Wada 2005 Appl. Phys. Lett. 87 041911
8. S. Tsukimoto T. Morita M. Moriyama K. Ito M. Murakami 2005 J. Electron. Mater. 34 592
9. K. Barmak C. Cabral Jr. K.P. Rodbell J.M.E. Harper 2006 J. Vac. Sci. Technol. B 24 2485
10. S. Tsukimoto T. Kabe K. Ito M. Murakami 2007 J. Electron. Mater. 36 258
11. J.P. Chu Y.Y. Hsieh C.H. Lin T. Mahalingam 2005 J. Mater. Res. 20 1379
12. J.P. Chu C.H. Lin 2005 Appl. Phys. Lett. 87 211902
13. J.P. Chu C.H. Lin V.S. John 2007 Appl. Phys. Lett. 91 132109
14. Y. He J.Y. Feng 2004 J. Cryst. Growth 263 203
15. T. Sun, B. Yao, A. Warren, V. Kumar, K. Barmak, and K.R. Coffey, IEEE IITC 2008, pp. 141-143
16. K. Barmak A. Gungor C. Cabral Jr. J.M.E. Harper 2003 J. Appl. Phys. 94 1605
17. A. Sakata, S. Kato. Y. Yano, H. Toyoda, T. Kawanoue, M. Hatano, J. Wada, N. Yamada, T. Oki, H. Yamaguchi, N. Nakamura, K. Higashi, M. Yamada, T. Fujimaki, and M. Hasunuma, IEEE IITC 2008, pp. 165-167
18. S. Song Y. Liu D. Mao H. Ling M. Li 2005 Thin Solid Films 476 142
19. J.P. Chu C.H. Lin Y.Y. Hsieh 2006 J. Electron. Mater. 35 76
20. M. Uekubo T. Oku K. Nii M. Murakami K. Takahiro S. Yamaguchi T. Nakano T. Ohta 1996 Thin Solid Films 286 170