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Volumn 85, Issue 9, 1999, Pages 6462-6469

Deposition, microstructure and properties of sputtered copper films containing insoluble molybdenum

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Indexed keywords


EID: 0000211721     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.370287     Document Type: Article
Times cited : (40)

References (22)
  • 1
    • 3342883786 scopus 로고
    • See, for example. Mater. Res. Bull. 19, (1994); Thin Solid Films 262, (1995).
    • (1994) Mater. Res. Bull. , vol.19
  • 2
    • 3342937672 scopus 로고
    • See, for example. Mater. Res. Bull. 19, (1994); Thin Solid Films 262, (1995).
    • (1995) Thin Solid Films , vol.262
  • 8
    • 85034564623 scopus 로고
    • Ph.D. dissertation, University of Illinois at Urbana-Champaign, Urbana, IL
    • H. Wang, Ph.D. dissertation, University of Illinois at Urbana-Champaign, Urbana, IL, 1994, pp. 1-124.
    • (1994) , pp. 1-124
    • Wang, H.1
  • 16
    • 0005678788 scopus 로고
    • edited by R. D. Shull and A. Joshi, TMS, Warrendale, PA
    • R. D. Shull, Thermal Analysis in Metallurgy, edited by R. D. Shull and A. Joshi (TMS, Warrendale, PA, 1992), pp. 95-119.
    • (1992) Thermal Analysis in Metallurgy , pp. 95-119
    • Shull, R.D.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.