Resistivity size effect in encapsulated Cu thin films

2008 IEEE International Interconnect Technology Conference, IITC

Volumn , Issue , 2008, Pages 141-143

  Sun, Tik ^a   Yao, Bo ^a   Warren, Andrew ^a   Kumar, Vineet ^b   Barmak, Katayun ^b   Coffey, Kevin R ^a  

^a UNIVERSITY OF CENTRAL FLORIDA   (United States)

^b CARNEGIE MELLON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER NETWORKS; CRYSTAL GROWTH; GRAIN BOUNDARIES; OPTICAL INTERCONNECTS; SILICON COMPOUNDS; THIN FILMS;

CU INTERCONNECTS; CU THIN FILMS; INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE;

COPPER;

EID: 50949088092     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2008.4546949     Document Type: Conference Paper

References (9)

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8. D. T. Carpenter, J. M. Rickman, and K. Barmak, "A methodology for automated quantitative microstructural analysis of transmission electron micrographs", Journal of Applied Physics, 84, 5843-5854 (1998). See Fig. 10.
9. L. Lu, Y. Shen, X. Chen, L. Qian, and K. Lu, "Ultrahigh strength and high electrical conductivity in copper," Science, volume 304, page 422-6, 2004