Thermal performance of sputtered insoluble Cu(W) films for advanced barrierless metallization

Journal of Electronic Materials

Volumn 35, Issue 1, 2006, Pages 76-80

  Chu, J P ^a   Lin, C H ^a,b   Hsieh, Y Y ^a  

^a NATIONAL TAIWAN OCEAN UNIVERSITY   (Taiwan)

^b CHIN MIN INSTITUTE OF TECHNOLOGY   (Taiwan)

Author keywords

Barrierless; Copper film; Focused ion beam; Metallization; Thermal cycling

Indexed keywords

COPPER FILM; FOCUSED ION BEAM; FOCUSED ION BEAM]; METALLIZATION APPLICATIONS;

COPPER; ION BEAMS; METALLIZING; SPUTTERING; THERMAL CYCLING; THERMOANALYSIS;

THIN FILMS;

EID: 32644446754     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-006-0187-9     Document Type: Conference Paper

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