Thermal stability enhancement in nanostructured Cu films containing insoluble tungsten carbides for metallization

Journal of Materials Research

Volumn 20, Issue 6, 2005, Pages 1379-1384

  Chu, J P ^a   Hsieh, Y Y ^a   Lin, C H ^a   Mahalingam, T ^a,b  

^a NATIONAL TAIWAN OCEAN UNIVERSITY   (Taiwan)

^b ALAGAPPA UNIVERSITY   (India)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; FILMS; HIGH TEMPERATURE EFFECTS; METALLIZING; NANOSTRUCTURED MATERIALS; SCANNING ELECTRON MICROSCOPY; SOLID SOLUTIONS; SOLUBILITY; THERMODYNAMIC STABILITY; TUNGSTEN CARBIDE; X RAY DIFFRACTION ANALYSIS; X RAY PHOTOELECTRON SPECTROSCOPY;

BARRIERLESS METALLIZATION APPLICATIONS; INSOLUBLE TUNGSTEN CARBIDES; SUPERSATURATED SOLID SOLUTION;

COPPER;

EID: 27844543303     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2005.0179     Document Type: Article

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