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Thin Solid Films

Volumn 397, Issue 1-2, 2001, Pages 143-151

A model of abrasive-free removal of copper films using an aqueous hydrogen peroxide-glycine solution

(2) Zhang, Lu a Shankar Subramanian, R a

a Clarkson University (United States)

Author keywords

Abrasive free polishing; Chemical mechanical polishing; Copper films

Indexed keywords

ABRASIVES; CHEMICAL MECHANICAL POLISHING; COPPER; HYDROGEN PEROXIDE; MASS TRANSFER; MATHEMATICAL MODELS; REACTION KINETICS;

GEOMETRICAL PARAMETERS;

METALLIC FILMS;

EID: 0035500190 PISSN: 00406090 EISSN: None Source Type: Journal
DOI: 10.1016/S0040-6090(01)01411-0 Document Type: Article

Times cited : (23)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.