Particle adhesion and removal in chemical mechanical polishing and post-CMP cleaning

Journal of the Electrochemical Society

Volumn 146, Issue 7, 1999, Pages 2665-2669

  Zhang, Fan ^a   Busnaina, Ahmed A ^b   Ahmadi, Goodarz ^b  

^a HONEYWELL   (United States)

^b CLARKSON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; BOUNDARY LAYERS; HARDNESS; HYDRODYNAMICS; PARTICLES (PARTICULATE MATTER); PLASTIC DEFORMATION; PRESSURE EFFECTS; SURFACE CLEANING; SURFACE ROUGHNESS;

CHEMICAL MECHANICAL POLISHING (CMP);

ELECTROLYTIC POLISHING;

EID: 0032625296     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1391989     Document Type: Article

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