-
1
-
-
34249882209
-
-
MRS Spring Meeting Proceedings, Vol. S. V.Babu, R.Singh, N.Hayasaka, and M.Oliver, Editors (Warrendals, PA
-
Chemical-Mechanical Planarization, MRS Spring Meeting Proceedings, Vol. 732E, S. V. Babu, R. Singh, N. Hayasaka, and, M. Oliver, Editors (Warrendals, PA, 2002).
-
(2002)
Chemical-Mechanical Planarization
, vol.732
-
-
-
2
-
-
33744807949
-
-
MRS Spring Meeting Proceedings, Vol. S. V.Babu, K. C.Cadien, and H.Yano, Editors (Warrendals, PA
-
Chemical-Mechanical Polishing: Advances and Future Challenges, MRS Spring Meeting Proceedings, Vol. 671, S. V. Babu, K. C. Cadien, and, H. Yano, Editors (Warrendals, PA, 2002).
-
(2002)
Chemical-Mechanical Polishing: Advances and Future Challenges
, vol.671
-
-
-
3
-
-
0029333140
-
-
J. G. Ryan, R. M. Geffken, N. R. Poulin, and J. R. Paraszczak, IBM J. Res. Dev., 39, 371 (1995).
-
(1995)
IBM J. Res. Dev.
, vol.39
, pp. 371
-
-
Ryan, J.G.1
Geffken, R.M.2
Poulin, N.R.3
Paraszczak, J.R.4
-
5
-
-
1042277679
-
-
Kluwer Academic Publishers, Norwell, MA
-
C. L. Borst, W. N. Gill, and R. J. Gutmann, Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses: Fundamental Mechanisms and Applications to IC Interconnect Technology, Kluwer Academic Publishers, Norwell, MA (2002).
-
(2002)
Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses: Fundamental Mechanisms and Applications to IC Interconnect Technology
-
-
Borst, C.L.1
Gill, W.N.2
Gutmann, R.J.3
-
6
-
-
0036802779
-
-
R. Bajaj, A. Zutshi, R. Surana, M. Naik, and T. Pan, MRS Bull., 2002, 776.
-
MRS Bull.
, vol.2002
, pp. 776
-
-
Bajaj, R.1
Zutshi, A.2
Surana, R.3
Naik, M.4
Pan, T.5
-
7
-
-
0242385494
-
-
H. Li, M. VanHaneham, and J. Quanci, Mater. Res. Soc. Symp. Proc., 767, F5.3 (2003).
-
(2003)
Mater. Res. Soc. Symp. Proc.
, vol.767
, pp. 53
-
-
Li, H.1
Vanhaneham, M.2
Quanci, J.3
-
8
-
-
0000688858
-
-
D. Zeidler, Z. Stavreva, M. Plotner, and K. Dresher, Microelectron. Eng., 33, 259 (1997).
-
(1997)
Microelectron. Eng.
, vol.33
, pp. 259
-
-
Zeidler, D.1
Stavreva, Z.2
Plotner, M.3
Dresher, K.4
-
9
-
-
2042470803
-
-
T. Du, D. Tamboli, V. Desai, and S. Seal, J. Electrochem. Soc., 151, G230 (2004).
-
(2004)
J. Electrochem. Soc.
, vol.151
, pp. 230
-
-
Du, T.1
Tamboli, D.2
Desai, V.3
Seal, S.4
-
10
-
-
0000246119
-
-
Q. Luo, D. R. Campbell, and S. V. Babu, Chem. Mater., 9, 2101 (1997).
-
(1997)
Chem. Mater.
, vol.9
, pp. 2101
-
-
Luo, Q.1
Campbell, D.R.2
Babu, S.V.3
-
11
-
-
0012663803
-
-
P. Wrschka, J. Hernandez, G. S. Oehrlein, J. A. Negrych, G. Haag, P. Rau, and J. E. Currie, J. Electrochem. Soc., 148, G321 (2001).
-
(2001)
J. Electrochem. Soc.
, vol.148
, pp. 321
-
-
Wrschka, P.1
Hernandez, J.2
Oehrlein, G.S.3
Negrych, J.A.4
Haag, G.5
Rau, P.6
Currie, J.E.7
-
12
-
-
18944404421
-
-
V. R. K. Gorantla, A. Babel, S. Pandija, and S. V. Babu, Electrochem. Solid-State Lett., 8, G131 (2005).
-
(2005)
Electrochem. Solid-State Lett.
, vol.8
, pp. 131
-
-
Gorantla, V.R.K.1
Babel, A.2
Pandija, S.3
Babu, S.V.4
-
13
-
-
34249878758
-
-
J. Amanokura, Y. Kamigata, M. Habiro, H. Suzuki, and M. Hanazono, Mater. Res. Soc. Symp. Proc., 732E, I1.2 (2002).
-
(2002)
Mater. Res. Soc. Symp. Proc.
, vol.732
, pp. 12
-
-
Amanokura, J.1
Kamigata, Y.2
Habiro, M.3
Suzuki, H.4
Hanazono, M.5
-
14
-
-
33744827060
-
-
H. Morishima, Y. Kamigata, Y. Kurata, K. Masuda, J. Amanokura, M. Yoshida, and M. Hanazono, Mater. Res. Soc. Symp. Proc., 671, M1.3 (2001).
-
(2001)
Mater. Res. Soc. Symp. Proc.
, vol.671
, pp. 13
-
-
Morishima, H.1
Kamigata, Y.2
Kurata, Y.3
Masuda, K.4
Amanokura, J.5
Yoshida, M.6
Hanazono, M.7
-
15
-
-
0000976704
-
-
Santa Clara, CA
-
H. Hirabayashi, M. Higuchi, M. Kinoshita, H. Kaneko, N. Hayasaka, K. Mase, and J. Oshima, in Proceedings of CMP-MIC Conference, p. 119, Santa Clara, CA, (1996).
-
(1996)
Proceedings of CMP-MIC Conference
, pp. 119
-
-
Hirabayashi, H.1
Higuchi, M.2
Kinoshita, M.3
Kaneko, H.4
Hayasaka, N.5
Mase, K.6
Oshima, J.7
-
16
-
-
0034292727
-
-
M. Hariharaputhiran, J. Zhang, S. Ramarajan, J. J. Keleher, Y. Li, and S. V. Babu, J. Electrochem. Soc., 147, 3820 (2000).
-
(2000)
J. Electrochem. Soc.
, vol.147
, pp. 3820
-
-
Hariharaputhiran, M.1
Zhang, J.2
Ramarajan, S.3
Keleher, J.J.4
Li, Y.5
Babu, S.V.6
-
18
-
-
0037439365
-
-
S. Seal, S. C. Kuiry, and B. Heinmen, Thin Solid Films, 423, 243 (2003).
-
(2003)
Thin Solid Films
, vol.423
, pp. 243
-
-
Seal, S.1
Kuiry, S.C.2
Heinmen, B.3
-
20
-
-
33744779578
-
-
Ph.D. Thesis, Clarkson University, Potsdam, NY
-
U. B. Patri, Ph.D. Thesis, Clarkson University, Potsdam, NY (2005).
-
(2005)
-
-
Patri, U.B.1
-
21
-
-
33744797044
-
-
Ph.D. Thesis, Clarkson University, Potsdam, NY
-
V. Gorantla, Ph.D. Thesis, Clarkson University, Potsdam, NY (2004).
-
(2004)
-
-
Gorantla, V.1
-
22
-
-
30344439560
-
-
V. Gorantla, D. Goia, E. Matijević, and S. V. Babu, J. Electrochem. Soc., 152, G912 (2005).
-
(2005)
J. Electrochem. Soc.
, vol.152
, pp. 912
-
-
Gorantla, V.1
Goia, D.2
Matijević, E.3
Babu, S.V.4
-
23
-
-
17644419968
-
-
V. Gorantla, E. Matijević, and S. V. Babu, Chem. Mater., 17, 2076 (2005).
-
(2005)
Chem. Mater.
, vol.17
, pp. 2076
-
-
Gorantla, V.1
Matijević, E.2
Babu, S.V.3
-
24
-
-
0842282250
-
-
P. C.Andrews, J. D.Dukovic, G. S.Mathad, G. M.Oleszek, H. S.Rathore, and C.Reidsema-Simpson, Editors, PV, p. The Electrochemical Society Proceedings Series, Pennington, NJ
-
S. Kondo, N. Sakuma, Y. Homma, and N. Ohashi, in Electrochemical Processing in VLSI Fabrication I-and-Interconnect and Contact Metallization: Materials, Processes, and Reliability, P. C. Andrews, J. D. Dukovic, G. S. Mathad, G. M. Oleszek, H. S. Rathore, and, C. Reidsema-Simpson, Editors, PV, p. 195, The Electrochemical Society Proceedings Series, Pennington, NJ, (1998).
-
(1998)
Electrochemical Processing in VLSI Fabrication I-and-Interconnect and Contact Metallization: Materials, Processes, and Reliability
, pp. 195
-
-
Kondo, S.1
Sakuma, N.2
Homma, Y.3
Ohashi, N.4
-
25
-
-
18944395010
-
-
PV 2002-1 S.Seal, R. L.Opila, C. R.Simpson, K.Sundaram, H.Huff, and I. I.Suni, Editors, The Electrochemical Society Proceedings Series, Pennington, NJ
-
D.-H. Eom, Y.-K. Hong, J.-Y. Park, J.-G. Park, J. J. Myung, K.-S. Kim, H.-S. Song, H.-S. Park, Y.-S. Choi, S.-Y. Song, and S.-I. Lee, in Chemical-Mechanical Planarization-V, S. Seal, R. L. Opila, C. R. Simpson, K. Sundaram, H. Huff, and, I. I. Suni, Editors, PV 2002-1, p. 226, The Electrochemical Society Proceedings Series, Pennington, NJ, (2002).
-
(2002)
Chemical-Mechanical Planarization-V
, pp. 226
-
-
Eom, D.-H.1
Hong, Y.-K.2
Park, J.-Y.3
Park, J.-G.4
Myung, J.J.5
Kim, K.-S.6
Song, H.-S.7
Park, H.-S.8
Choi, Y.-S.9
Song, S.-Y.10
Lee, S.-I.11
-
27
-
-
33744808492
-
-
Paper 1707 presented at the 27 April - 2 May Meeting of The Electrochemical Society, Paris, France
-
J. Jayashankar, U. Patri, and E. Johns, Paper 1707 presented at the 27 April - 2 May Meeting of The Electrochemical Society, Paris, France, 2003.
-
(2003)
-
-
Jayashankar, J.1
Patri, U.2
Johns, E.3
-
28
-
-
0013418486
-
-
J. Hernandez, P. Wrschka, and G. S. Oehrlein, J. Electrochem. Soc., 148, G389 (2001).
-
(2001)
J. Electrochem. Soc.
, vol.148
, pp. 389
-
-
Hernandez, J.1
Wrschka, P.2
Oehrlein, G.S.3
-
32
-
-
0004192071
-
-
Butterworths, Washington DC
-
C. W. Davies, Ion Association, p. 17, Butterworths, Washington DC (1962).
-
(1962)
Ion Association
, pp. 17
-
-
Davies, C.W.1
-
33
-
-
0000277010
-
-
D. D. Wagman, W. H. Evans, V. B. Parker, R. H. Schumm, I. Halow, S. M. Bailey, K. L. Churney, and R. L. Nuttall, J. Phys. Chem. Ref. Data Suppl., 11, Suppl. 2-154 (1982).
-
(1982)
J. Phys. Chem. Ref. Data Suppl.
, vol.11
, pp. 2-154
-
-
Wagman, D.D.1
Evans, W.H.2
Parker, V.B.3
Schumm, R.H.4
Halow, I.5
Bailey, S.M.6
Churney, K.L.7
Nuttall, R.L.8
-
35
-
-
12244313915
-
-
V. Gorantla, S. B. Emery, S. Pandija, S. V. Babu, and D. Roy, Mater. Lett., 59, 690 (2005).
-
(2005)
Mater. Lett.
, vol.59
, pp. 690
-
-
Gorantla, V.1
Emery, S.B.2
Pandija, S.3
Babu, S.V.4
Roy, D.5
-
36
-
-
0003508875
-
-
John Wiley & Sons, New York
-
J. M. Stegerwald, S. P. Murarka, and R. J. Gutmann, Chemical-Mechanical Planarization of Microelectronic Materials, p. 226, John Wiley & Sons, New York (1997).
-
(1997)
Chemical-Mechanical Planarization of Microelectronic Materials
, pp. 226
-
-
Stegerwald, J.M.1
Murarka, S.P.2
Gutmann, R.J.3
-
37
-
-
30544439766
-
-
Y. Hong, U. B. Patri, S. Ramakrishnan, and S. V. Babu, Mater. Res. Soc. Symp. Proc., 867, W1.10, (2005).
-
(2005)
Mater. Res. Soc. Symp. Proc.
, vol.867
, pp. 110
-
-
Hong, Y.1
Patri, U.B.2
Ramakrishnan, S.3
Babu, S.V.4
-
38
-
-
33744798443
-
-
presented at SEMICON WEST, San Francisco, CA, (July
-
Y. Hong, U. Patri, S. Pandija, and S. V. Babu, Inhibition of Dissolution Rate of Cu for Planarization Applications, presented at SEMICON WEST, San Francisco, CA, (July 2005).
-
(2005)
Inhibition of Dissolution Rate of Cu for Planarization Applications
-
-
Hong, Y.1
Patri, U.2
Pandija, S.3
Babu, S.V.4
-
39
-
-
30444441118
-
-
Y. Hong, U. B. Patri, S. Ramakrishnan, D. Roy, and S. V. Babu, J. Mater. Res., 20, 3413 (2005).
-
(2005)
J. Mater. Res.
, vol.20
, pp. 3413
-
-
Hong, Y.1
Patri, U.B.2
Ramakrishnan, S.3
Roy, D.4
Babu, S.V.5
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