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Volumn 47, Issue 6 PART 2, 2008, Pages 5242-5247
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Modification of the mechanical properties of SiO2 thin film using plasma treatments for micro-electro-mechanical systems applications
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Author keywords
Chemical properties; Mechanical properties; Micro electro mechanical systems (MEMS); Microcantilever; Plasma treatment technology
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Indexed keywords
CHEMICAL PROPERTIES;
COMPOSITE MICROMECHANICS;
MECHANICAL ENGINEERING;
MECHANICS;
MECHATRONICS;
MEMS;
MICROELECTROMECHANICAL DEVICES;
NATURAL FREQUENCIES;
PLASMA APPLICATIONS;
PLASMAS;
SEMICONDUCTING SILICON COMPOUNDS;
SILICON;
SILICON COMPOUNDS;
THICK FILMS;
THIN FILM DEVICES;
APPLICATIONS.;
EFFICIENT;
FILM USING;
H BONDS;
MECHANICAL CHARACTERISTICS;
MEMS STRUCTURES;
MICRO-ELECTRO-MECHANICAL SYSTEMS;
MICRO-ELECTRO-MECHANICAL SYSTEMS (MEMS);
MICROCANTILEVER;
MICROMACHINED BEAMS;
NOVEL METHODS;
PLASMA SURFACE MODIFICATIONS;
PLASMA TREATMENT TECHNOLOGY;
PLASMA TREATMENTS;
RESONANT FREQUENCIES;
YOUNG'S MODULUS;
MECHANICAL PROPERTIES;
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EID: 55049087891
PISSN: 00214922
EISSN: 13474065
Source Type: Journal
DOI: 10.1143/JJAP.47.5242 Document Type: Article |
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Times cited : (3)
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References (26)
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