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Volumn 18, Issue 3, 1995, Pages 458-461
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Advanced Low-Cost Bare-DIE Packaging Technology for Liquid Crystal Displays
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Author keywords
COG; LCD; LCD driver packaging; TAB
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Indexed keywords
ASSEMBLY;
BONDING;
COSTS;
LIQUID CRYSTAL DISPLAYS;
LSI CIRCUITS;
PERFORMANCE;
RELIABILITY;
SURFACE MOUNT TECHNOLOGY;
THIN FILM TRANSISTORS;
BARE DIE PACKAGING;
CHIP ONGLASS TECHNOLOGY;
FINE PITCH MOUNTING;
PIXEL PITCH;
QUAD FLAT PACKS;
TAPE AUTOMATED BONDING;
ELECTRONICS PACKAGING;
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EID: 0029377876
PISSN: 10709886
EISSN: None
Source Type: Journal
DOI: 10.1109/95.465136 Document Type: Article |
Times cited : (14)
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References (9)
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