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Volumn 18, Issue 3, 1995, Pages 458-461

Advanced Low-Cost Bare-DIE Packaging Technology for Liquid Crystal Displays

Author keywords

COG; LCD; LCD driver packaging; TAB

Indexed keywords

ASSEMBLY; BONDING; COSTS; LIQUID CRYSTAL DISPLAYS; LSI CIRCUITS; PERFORMANCE; RELIABILITY; SURFACE MOUNT TECHNOLOGY; THIN FILM TRANSISTORS;

EID: 0029377876     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.465136     Document Type: Article
Times cited : (14)

References (9)
  • 1
    • 84941868840 scopus 로고
    • Flip-chip COX technology and reliability evaluation
    • Apr.
    • T. Nukii, “Flip-chip COX technology and reliability evaluation, “ Electronics Jitsuzo Gijutsu, pp. 29-37, Apr. 1992.
    • (1992) Electronics Jitsuzo Gijutsu , pp. 29-37
    • Nukii, T.1
  • 2
    • 84871192393 scopus 로고
    • Chip on glass technology for large capacity and high resolution LCD
    • M. Masuda, “Chip on glass technology for large capacity and high resolution LCD,” in IEMT Symp. Proc., 1989, pp. 57-60.
    • (1989) IEMT Symp. Proc. , pp. 57-60
    • Masuda, M.1
  • 3
    • 84941856384 scopus 로고
    • Film carriers and bump formation technology
    • June
    • M. Suzuki, “Film carriers and bump formation technology,” Semiconductor World Monthly, pp. 113-125, June 1989.
    • (1989) Semiconductor World Monthly , pp. 113-125
    • Suzuki, M.1
  • 4
    • 84941871141 scopus 로고
    • The beginning of non-LCD applications of TAB technology with mainstream LSI’s
    • Feb.
    • T. Nakamura, “The beginning of non-LCD applications of TAB technology with mainstream LSI’s,” Nikkei Microdevices, pp. 106-107, Feb. 1990.
    • (1990) Nikkei Microdevices , pp. 106-107
    • Nakamura, T.1
  • 5
    • 84941864741 scopus 로고
    • Bare-Die packaging technology for liquid crystal displays
    • Jan.
    • T. Kobayashi, “Bare-Die packaging technology for liquid crystal displays,” Surface Mounting Technol., pp. 19-23, Jan. 1993.
    • (1993) Surface Mounting Technol. , pp. 19-23
    • Kobayashi, T.1
  • 6
    • 84941858559 scopus 로고
    • Flat-panel displays: Breaking barriers to COG implementation for LSI driver packaging technology and higher definition
    • Nov.
    • K. Inoue, “Flat-panel displays: Breaking barriers to COG implementation for LSI driver packaging technology and higher definition,” Flat Panel Display, pp. 181-188, Nov. 1991.
    • (1991) Flat Panel Display , pp. 181-188
    • Inoue, K.1
  • 7
    • 84941856468 scopus 로고
    • Current conditions and trends in TAB bonding technology and TAB applications with liquid crystal substrates
    • May
    • M. Suzuki, “Current conditions and trends in TAB bonding technology and TAB applications with liquid crystal substrates,” Electronics Jitsuzo Gijutsu, pp. 12-19, May 1992.
    • (1992) Electronics Jitsuzo Gijutsu , pp. 12-19
    • Suzuki, M.1
  • 8
    • 84941867375 scopus 로고
    • Exploring optimization of bare chip packaging
    • Jan.
    • S. Honda and K. Ajiki, “Exploring optimization of bare chip packaging,” Surface Mount Technol., pp. 28-32, Jan. 1993.
    • (1993) Surface Mount Technol. , pp. 28-32
    • Honda, S.1    Ajiki, K.2
  • 9
    • 84941865517 scopus 로고
    • Optimal packaging design and packaging bonding technology for liquid crystal display module
    • Mar.
    • A. Suzuki, “Optimal packaging design and packaging bonding technology for liquid crystal display module,” Surface Mount Technol., pp. 10-16, Mar. 1993.
    • (1993) Surface Mount Technol. , pp. 10-16
    • Suzuki, A.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.