Effect of solder bump geometry on the microstructure of Sn-3.5 wt% Ag on electroless nickel immersion gold during solder dipping

Journal of Materials Research

Volumn 20, Issue 3, 2005, Pages 649-658

  Huang, Zhiheng ^a   Conway, Paul P ^a   Liu, Changqing ^a   Thomson, Rachel C ^a  

^a LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

DISSOLUTION; ELECTROLESS PLATING; ELECTRONICS PACKAGING; GOLD; INTERMETALLICS; KINETIC THEORY; LIQUID METALS; METALLOGRAPHIC MICROSTRUCTURE; NICKEL PLATING; PRINTED CIRCUIT BOARDS; SOLDERING ALLOYS; THERMODYNAMICS;

ELECTROLESS NICKEL IMMERSION GOLD; SOLDER BUMP; SOLDER DIPPING; THERMODYNAMIC-KINETIC MODEL;

TIN ALLOYS;

EID: 29044440898     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2005.0078     Document Type: Article

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