Effect of bismuth on the growth kinetics of intermetallic compounds in Sn-3.5Ag solder joints: A growth kinetic model

Metals and Materials International

Volumn 10, Issue 2, 2004, Pages 123-131

  Huh, Joo Youl ^a   Han, Sang Uk ^b   Park, Chang Yong ^a,b  

^a Korea University   (South Korea)

^b SAMSUNG Electronics   (South Korea)

Author keywords

Growth kinetics; Interfacial reaction barriers; Intermetallic compounds; Sn Ag Bi solder

Indexed keywords

BINARY ALLOYS; BISMUTH; COPPER ALLOYS; GROWTH KINETICS; INTERMETALLICS; KINETIC PARAMETERS; KINETIC THEORY; LEAD-FREE SOLDERS; LIQUIDS; REACTION KINETICS; SILVER ALLOYS; TERNARY ALLOYS;

AGING TEMPERATURES; GROWTH ENHANCEMENT; INTERFACIAL REACTION BARRIERS; KINETIC MODELING; LAYER GROWTH; SN-3.5AG SOLDERS; SN-AG-BI SOLDER; SOLDER JOINTS;

TIN ALLOYS;

EID: 11144331373     PISSN: 15989623     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF03027315     Document Type: Article

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