Size effect in Cu nano-interconnects and its implication on electromigration

2008 2nd IEEE International Nanoelectronics Conference, INEC 2008

Volumn , Issue , 2008, Pages 610-613

  Hou, Yuejin ^a   Tan, Cher Ming ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Electromigration; Nano interconnect; Size effect

Indexed keywords

COPPER ALLOYS; ELECTRIC PROPERTIES; ELECTRONICS ENGINEERING; METALLIZING; NANOELECTRONICS;

ELECTRICAL PROPERTIES; ELECTROMIGRATION; MEAN FREE PATH; NANO-INTERCONNECT; NANO-INTERCONNECTS; SIZE EFFECT; SIZE EFFECTS;

COPPER;

EID: 52649118667     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/INEC.2008.4585561     Document Type: Conference Paper

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