Porosity effect on the dielectric constant and thermomechanical properties of organosilicate films

Applied Physics Letters

Volumn 81, Issue 22, 2002, Pages 4180-4182

  Liu, Junjun ^a   Gan, Dongwen ^a   Hu, Chuan ^a   Kiene, Michael ^a   Ho, Paul S ^a   Volksen, Willi ^b   Miller, Robert D ^b  

^a UNIVERSITY OF TEXAS AT AUSTIN   (United States)

^b IBM ALMADEN RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

PERCOLATION (SOLID STATE); PERMITTIVITY; POROSITY; SILICON; THERMAL CONDUCTIVITY; THERMAL EXPANSION; THERMAL STRESS;

ORGANOSILICATE FILMS;

PLASTIC FILMS;

EID: 0037175794     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1525054     Document Type: Article

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