Low-temperature, fine-pitch interconnections using self-patternable metallic nanoparticles as the bonding layer

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 1410-1416

  Mehrotra, Gaurav ^a   Jha, Gopal ^a   Goud, Janagama D ^a   Raj, P Markondeya ^a   Venkatesan, Mali ^b   Iyer, Mahadevan ^a   Hess, Dennis ^c   Tummala, Rao ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b APPLIED MATERIALS INC   (United States)

^c GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC COMPONENTS; FINE PITCH; METALLIC NANOPARTICLES;

CMOS INTEGRATED CIRCUITS; COMPUTER NETWORKS; COPPER; COPPER OXIDES; DIES; LAW ENFORCEMENT; NANOPARTICLES; NANOSTRUCTURED MATERIALS; NANOSTRUCTURES; SURFACE CHEMISTRY; SURFACE PLASMON RESONANCE; SURFACE TENSION; THICK FILMS; VACUUM;

WAFER BONDING;

EID: 51349163215     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550162     Document Type: Conference Paper

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