Fabrication technologies for three-dimensional integrated circuits

Proceedings - International Symposium on Quality Electronic Design, ISQED

Volumn 2002-January, Issue , 2002, Pages 33-37

  Reif, Rafael ^a   Fan, Andy ^a   Chen, Kuan Neng ^b   Das, Shamik ^a  

^a USA   (United States)

^b Massachusetts Institute of Technology Cambridge   (United States)

Author keywords

CMOS technology; Computer science; Epitaxial growth; Fabrication; Integrated circuit interconnections; Integrated circuit technology; Materials science and technology; System on a chip; Three dimensional integrated circuits; Wafer bonding

Indexed keywords

APPLICATION SPECIFIC INTEGRATED CIRCUITS; CMOS INTEGRATED CIRCUITS; COMPUTER AIDED DESIGN; COMPUTER SCIENCE; EPITAXIAL GROWTH; FABRICATION; GROWTH (MATERIALS); INTEGRATED CIRCUIT INTERCONNECTS; INTEGRATED CIRCUITS; SYSTEM-ON-CHIP; TEMPERATURE; THREE DIMENSIONAL INTEGRATED CIRCUITS; VLSI CIRCUITS;

CMOS TECHNOLOGY; INTEGRATED CIRCUIT INTERCONNECTIONS; INTEGRATED CIRCUIT TECHNOLOGY; MATERIALS SCIENCE AND TECHNOLOGY; SYSTEM ON A CHIP;

WAFER BONDING;

EID: 84948471389     PISSN: 19483287     EISSN: 19483295     Source Type: Journal    
DOI: 10.1109/ISQED.2002.996687     Document Type: Article

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