Chip scale studies of BCB based polymer bonding for MEMS packaging

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 1869-1873

  Wang, C H ^a   Zeng, J ^a   Zhao, K ^a   Chan, H L ^a  

^a HERIOT WATT UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ABS RESINS; ALUMINA; CHEMICAL SENSORS; CHIP SCALE PACKAGES; COMPOSITE MICROMECHANICS; COMPUTER NETWORKS; ELECTRONIC EQUIPMENT MANUFACTURE; GLASS; MEMS; MICROELECTROMECHANICAL DEVICES; OPTICAL PROPERTIES; OPTICAL TESTING; PHOTOSENSITIVE GLASS; PHOTOSENSITIVITY; POLYMERIC GLASS; POLYMERS; SILICON; SUBSTRATES; TITANIUM;

BCB POLYMER; CHIP-SCALE; FEEDTHROUGH; HOT PLATES;

GLASS BONDING;

EID: 51349138914     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550236     Document Type: Conference Paper

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