Laser-Assisted Sealing and Testing for Ceramic Packaging of MEMS Devices

IEEE Transactions on Advanced Packaging

Volumn 26, Issue 3, 2003, Pages 283-288

  Tao, Yi ^a   Malshe, Ajay P ^a   Brown, Wiliam D ^a   DeReus, Dana R ^b,c   Cunningham, Shawn ^b,c  

^a UNIVERSITY OF ARKANSAS   (United States)

^b European Headquarter and Development Center   (United States)

^c wiSpry Inc   (United States)

Author keywords

Electric breakdown; Hermeticity testing; Laser sealing; MEMS

Indexed keywords

CARBON DIOXIDE LASERS; ELECTRIC BREAKDOWN; ENCAPSULATION; MICROELECTROMECHANICAL DEVICES; SEALING (CLOSING); SILICON;

HERMETICITY TESTING;

ELECTRONICS PACKAGING;

EID: 0142196113     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2003.817969     Document Type: Article

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