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Volumn 55, Issue 5, 2007, Pages 1040-1044

Design, fabrication, and measurement of benzocyclobutene polymer zero-level packaging for millimeter-wave applications

Author keywords

Benzocyclobutene (BCB) film; Millimeter wave; Wafer level packaging; Zero level packaging

Indexed keywords

ELECTROPLATING; INSERTION LOSSES; NATURAL FREQUENCIES; RESONATORS; SILICON COMPOUNDS; THIN FILMS;

EID: 34248226326     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/TMTT.2007.895411     Document Type: Article
Times cited : (31)

References (12)
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    • Packaging for RF MEMS devices using LTCC substrate and BCB adhesive layer
    • K.-I. Kim, J.-M. Kim, G.-C. Hwang, C.-W. Baek, and Y.-K. Kim, "Packaging for RF MEMS devices using LTCC substrate and BCB adhesive layer," J. Micromech, Microeng., vol. 16, no. 1, pp. 150-156, 2006.
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    • _, "Zero-level packaging using BCB adhesive bonding and glass wet-etching for W-band applications," Electron. Lett., vol. 42, no. 13, pp. 755-756, Jun. 2006.
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  • 10
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    • A study on wafer-level vacuum packaging for MEMS devices
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.