Mechanical and electrical characterization of benzocyclobutene membrane packaging

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 1685-1689

  Seok, S ^a   Rolland, N ^a   Rolland, P A ^a  

^a INSTITUT D ELECTRONIQUE   (France)

Author keywords

[No Author keywords available]

Indexed keywords

COPLANAR WAVEGUIDES; ELECTRONICS PACKAGING; ENCAPSULATION; SILICON WAFERS; WSI CIRCUITS;

ANSYS MODEL; MECHANICAL RESONANT FREQUENCY;

OLEFINS;

EID: 35348919370     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.374021     Document Type: Conference Paper

References (12)

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