Comparison of Ni/Ti and Ni ohmic contacts on n-type 6H-SiC

Journal of Materials Science: Materials in Electronics

Volumn 19, Issue 11, 2008, Pages 1039-1044

  Barda, Bohumil ^a   Macháč, Petr ^a   Hubičková, Marie ^a   Náhlík, Josef ^a  

^a INSTITUTE OF CHEMICAL TECHNOLOGY   (Czech Republic)

Author keywords

[No Author keywords available]

Indexed keywords

CONTACT STRUCTURES; DOPING LEVELS; ELECTRICAL PARAMETERS; IN-VACUUM; PLASMA CLEANING; SPECIFIC CONTACT RESISTANCES;

NICKEL; NICKEL ALLOYS; OHMIC CONTACTS; PLASMA DEPOSITION; PLASMAS; SILICON CARBIDE; VACUUM;

VACUUM EVAPORATION;

EID: 50349092470     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-007-9446-7     Document Type: Article

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