Assembly technology development for 3D silicon stacked module for handheld products

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 1300-1307

  Ganesh, V P ^c   Lim, Samuel ^c   Witarsa, David ^a   Yin, Hnin Wai ^c   Kumar, Madhu ^b   Lim, L A ^b   Yoon, S W ^c   Kripesh, V ^c  

^a Atotech SEA Ltd   (Singapore)

^b ASM   (Singapore)

^c INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP INTERCONNECT; GLASS CAP FABRICATION; WEDGE BONDING; WIRE BONDING;

ELECTRIC LINES; HAND HELD COMPUTERS; HEAT LOSSES; INTEGRATED CIRCUIT LAYOUT;

SILICON;

EID: 33845595475     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645822     Document Type: Conference Paper

References (11)

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