Thermodynamic calculation of phase equilibria and its applications in the Sn-Ag-Cu-Ni-Au system

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2007, Pages

  Gao, F ^a   Wang, C P ^a   Liu, X J ^a   Ishida, K ^b  

^a XIAMEN UNIVERSITY   (China)

^b TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ARSENIC COMPOUNDS; BRAZING; CHEMICAL ENGINEERING; CHLORINE COMPOUNDS; COPPER; COPPER ALLOYS; DIFFUSION COATINGS; ELECTRONICS PACKAGING; GOLD; INTERMETALLICS; LEAD; LEAD ALLOYS; METALS; NICKEL; NICKEL ALLOYS; PHASE EQUILIBRIA; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; SURFACE DIFFUSION; TECHNOLOGY; THERMODYNAMICS; TIN ALLOYS; WELDING;

CALPHAD METHODS; DIFFUSION BARRIER LAYER; ELECTRONIC PACKAGING; GOLD (AU); INTERFACIAL REACTIONS; INTERMETALLIC COMPOUND; INTERNATIONAL CONFERENCES; LEAD-FREE SOLDERING; PB-FREE SOLDERS; SN-AG-CU; SN-AG-CU-NI; SN-PB EUTECTIC SOLDER; SOLDERABILITY;

TIN;

EID: 50249135963     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2007.4441439     Document Type: Conference Paper

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