Application of CALPHAD in soldering of electronic materials

Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals

Volumn 13, Issue 6, 2003, Pages 1343-

  Liu, Chun Lei ^a   Jin, Zhan Peng ^a   Liu, Hua Shan ^a  

^a NONE

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EID: 1242306170     PISSN: 10040609     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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