Thermodynamic database on microsolders and copper-based alloy systems

Journal of Electronic Materials

Volumn 32, Issue 11, 2003, Pages 1265-1272

  Liu, X J ^a   Ohnuma, I ^a   Wang, C P ^a   Jiang, M ^a   Kainuma, R ^a   Ishida, K ^a   Ode, M ^b   Koyama, T ^c   Onodera, H ^c   Suzuki, T ^b  

^a TOHOKU UNIVERSITY   (Japan)

^b UNIVERSITY OF TOKYO   (Japan)

^c NATIONAL INSTITUTE FOR MATERIALS SCIENCE   (Japan)

Author keywords

Calculation of phase diagram; Cu based alloys; Interfacial reaction; Pb free solders; Phase field method; Thermodynamic database

Indexed keywords

BINARY ALLOYS; COMPOSITION EFFECTS; COPPER ALLOYS; DATABASE SYSTEMS; ELECTRONICS PACKAGING; INTERFACES (MATERIALS); LEAD ALLOYS; PHASE DIAGRAMS; THERMODYNAMIC PROPERTIES;

LEAD FREE SOLDERS; MICROSOLDERS; MULTICOMPONENT SYSTEM; THERMODYNAMIC DATABASES;

SOLDERING ALLOYS;

EID: 0346846608     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-003-0021-6     Document Type: Article

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