The use of phase diagrams and thermodynamic databases for electronic materials

JOM

Volumn 55, Issue 12, 2003, Pages 53-59

  Liu, X J ^a   Oikawa, K ^b   Ohnuma, I ^a   Kainuma, R ^a   Ishida, K ^a  

^a TOHOKU UNIVERSITY   (Japan)

^b NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER ALLOYS; DATABASE SYSTEMS; ELECTRONICS PACKAGING; HARD DISK STORAGE; INTERFACES (MATERIALS); LEAD ALLOYS; MAGNETIC RECORDING; SHAPE MEMORY EFFECT; SOLDERING ALLOYS;

LEAD FREE SOLDERS; THERMODYNAMIC DATABASES;

PHASE DIAGRAMS;

EID: 0742321667     PISSN: 10474838     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11837-003-0012-3     Document Type: Article

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