Primary solidification phases of the Sn-rich Sn-Ag-Cu-Ni quaternary system

Journal of Electronic Materials

Volumn 34, Issue 8, 2005, Pages 1135-1142

  Chang, Cheng An ^a   Chen, Sinn Wen ^a   Chiu, Chen Nan ^a   Huang, Yu Chih ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Liquidus projection; Pb free solders; Sn Ag Cu Ni; Solidification

Indexed keywords

COMPOSITION; EUTECTICS; INFORMATION ANALYSIS; METALLOGRAPHY; NICKEL; SOLIDIFICATION; TIN;

LIQUIDUS PROJECTION; PB-FREE SOLDERS; SN-AG-CU-NI; TERNARY SOLDERS;

SOLDERING ALLOYS;

EID: 24144467868     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-005-0242-y     Document Type: Article

References (10)

1. Official Journal of the European Union, p. L37/19 (13.2.2003).
2. "Lead-free Assembly Projects," National Electronics Manufacturing Initiatives (NEMI), http://www.nemi.org/projects/ese/lf_assembly. html, 1999.
3. "Roadmap 2002 for Commercialization of Lead-Free Solder," Lead-Free Soldering Roadmap Committee, Technical Standardization Committee on Electronics Assembly Technology, Japan Electronics and Information Technology Industries Association (JEITA), 2002.
4. K.N. Tu and K. Zeng, Mater. Sci. Eng. R34, 1 (2001).
5. C.-H. Lin, S.-W. Chen, and C.-H. Wang, J. Electron. Mater. 31, 907 (2002).
6. S.-W. Chen, H.-F. Hsu, and C.-W. Lin, J. Mater. Res. 19, 2262 (2004).
7. E. Gebhardt and G. Petzow, Z. Metallkd. 50, 597 (1959).
8. Y.-A. Chang, D. Goldberg, and J.-P. Neumann, J. Phys. Chem. Ref. Data 6, 621 (1977).
9. H.-T. Luo and S.-W. Chen, J. Mater. Sci. 31, 5059 (1996).
10. S.-W. Chen and C.-A. Chang, J. Electron. Mater. 33, 1071 (2004).