Comprehensive hygro-thermo-mechanical modeling and testing of stacked die BGA module with molded underfill

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 196-200

  Zhang, Xueren ^a   Tee, Tong Yan ^a   Ng, Hun Shen ^a   Teysseyre, Jerome ^a   Loo, Shane ^b   Mhaisalkar, Subodh ^b   Ng, Fong Kuan ^c   Lim, Chwee Teck ^c   Du, Xinyu ^d   Bool, Eric ^d   Zhu, Wenhui ^d   Chew, Spencer ^d  

^a STMICROELECTRONICS   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^c NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^d Cookson Electronics ^*  (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

BGA MODULE; HYGRO-THERMO-MECHANICAL MODELING; UNDERFILLS; WIRE BOND (WB);

FLIP CHIP DEVICES; MOISTURE; SEMICONDUCTOR DEVICE TESTING; SHEAR STRENGTH; STRESSES; SURFACE PROPERTIES;

ELECTRONICS PACKAGING;

EID: 24644464358     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. th European Microelectronics and Packaging Conference Proc., 2001, pp. 330-335.
2. th EPTC Conference Proc., Singapore, Dec. 2002, pp. 391-397.
3. Ken, G., Bruce, C., and Tian C., Molded Underfill for Flip Chip in Package, The Magazine of High-density Interconnect, 2000, pp. 1-5.
4. rd ECTC Conference Proc., 2003, pp. 962-970.
5. th ECTC Conference Proc., 2000, pp. 576-580.
6. Tee, T. Y., Kho, C. L., Yap, D., Toh, C., Baraton, X., Zhong, Z., "Reliability Assessment and Hygroswelling Modeling of FCBGA with No-flow Underfill", Microelectronics Reliability, Vol. 43(5), 2003, pp. 741-749.
7. Chung, C. L., Fan, J., Huang, M. L., and Tsai, F. J., "Study on Failure Mechanism of PCT Reliability for BT Substrate Based CSP (Chip Scale Package)", Transactions of the ASME, Journal of Electronic Packaging, Vol. 124, Dec., 2002, pp. 334-339.