Characterization of molded underfill material for flip chip ball grid array packages

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 288-292

  Liu, F ^a   Wang, Y P ^a   Chai, K ^a   Her, T D ^a  

^a SILICONWARE PRECISION INDUSTRIES CO LTD   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CURING; DIFFERENTIAL SCANNING CALORIMETRY; FATIGUE OF MATERIALS; FLIP CHIP DEVICES; GLASS TRANSITION; TEMPERATURE; THERMAL EXPANSION; THERMOGRAVIMETRIC ANALYSIS;

COEFFICIENT OF THERMAL EXPANSION; FLIP CHIP BALL GRID ARRAY PACKAGES; MOLDING COMPOUND MATERIAL; SOLDER BUMPS; THERMAL MECHANICAL ANALYZER; UNDERFILL MATERIALS;

ELECTRONICS PACKAGING;

EID: 0034835522     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

1. Underill study of flip chip ball grid array package
2. Transfer molded underill for FC-BGA
3. Underfill flow as viscous flow between parallel plates driven by capillary action
4. Review of underfill encapsulant development and performance of flip chip applications
5. Assembly development for large IC flip chip ball grid array package
6. Development of flip chip CSP package
7. Flip chip technologies
8. High performance no flow underfills for low-cost flip-chip applications
9. Development of the wafer level compressive-flow underfill encapaulant
10. Fast-flow underfill encapsulant: Flow rate and coefficient of thermal expansion
11. Prediction of the viscosity of multimodal suspensions from unimodal viscosity data
12. Rheological analysis of a underfill material