Reliability issues of low-cost overmolded flip-chip packages

IEEE Transactions on Advanced Packaging

Volumn 28, Issue 1, 2005, Pages 79-88

  Lin, Yaomin ^a   Liu, Wenning ^a   Guo, Yifan ^b   Shi, Frank G ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b SKYWORKS SOLUTIONS INC   (United States)

Author keywords

Critical stress; Finite element (FE) methods; Flip chip; Optimal package design; Overmolded package; Parametric study

Indexed keywords

FINITE ELEMENT METHOD; FLIP CHIP DEVICES; INTEGRATED CIRCUIT LAYOUT; RELIABILITY; SEMICONDUCTOR DEVICE STRUCTURES; SEMICONDUCTOR DEVICE TESTING; STRESS ANALYSIS; SUBSTRATES; THERMAL EXPANSION; THERMAL STRESS;

CRITICAL STRESS; FLIP CHIP PACKAGES; OPTIMAL PACKAGE DESIGN; OVERMOLDED PACKAGE; PARAMETRIC STUDY;

CHIP SCALE PACKAGES;

EID: 13944277275     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2004.841670     Document Type: Article

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