Challenge of vacuum molded flip chip packaging technology

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, POLYTRONIC 2002 - Conference Proceedings

Volumn , Issue , 2002, Pages 221-224

  Chai, K ^a   Wu, E ^a   Tong, J Y ^a  

^a SILICONWARE PRECISION INDUSTRIES CO LTD   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; AUTOMOBILE MANUFACTURE; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; MICROELECTRONICS; MOLDING; PARTICLE SIZE; PHOTONICS; POLYMERS;

ALTERNATIVE SOLUTIONS; EQUIPMENT VENDORS; FLIP-CHIP PACKAGES; FLIP-CHIP PACKAGING; MOLDING EQUIPMENT; PACKAGE PERFORMANCE; RELIABILITY PERFORMANCE; VACUUM PROCESSING;

CHIP SCALE PACKAGES;

EID: 50049097358     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/POLYTR.2002.1020218     Document Type: Conference Paper

References (3)

1. Yung-Sen Lin, Kevin Chai, T. D. Her and Randy Lo, "Transfer Molded Underfill for FC-BGA", Proceeding of the SEMICON Taiwan 2000, Taipei, Taiwan, September 13-15, 2000.
2. Fenny Liu, Y. P. Wang, Kevin Chai and T. D. Her, "Characterization of Molded Underfill Material for Flip Chip Ball Grid Array Packages", proceedings of the 51th Electronic Components & Technology Conference (ECTC 2001), Florida, USA, May 29 - June 1, 2001.
3. Kevin Chai and Larry Wu, "The Underfill Processing Technologies for Flip Chip Packages", proceeding of the 1st International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (Polytronic 2001), Podsdam, Germany, October 21-24, 2001.