Package design and materials selection optimization for overmolded flip chip packaging

IEEE Transactions on Advanced Packaging

Volumn 29, Issue 3, 2006, Pages 525-532

  Lin, Yaomin ^a   Shi, Frank G ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Finite element methods; Flip chip; Interfacial stress; Overmolded package; Parametric study

Indexed keywords

COMPUTER SIMULATION; DIES; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; INTERFACES (MATERIALS); MOLDING; OPTIMIZATION; STRESS ANALYSIS;

INTERFACIAL STRESS; MATERIALS COMBINATIONS; OVERMOLDED PACKAGE; PACKAGE GEOMETRIES;

FLIP CHIP DEVICES;

EID: 33747607041     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2006.875406     Document Type: Article

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