High temperature potential of Flip Chip assemblies for automotive applications

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 376-383

  Braun, T ^a   Becker, K F ^a   Sommer, J P ^a   Loher T ^b   Schottenloher, K ^c   Kohl, R ^d   Pufall, R ^e   Bader, V ^a   Koch, M ^a   Aschenbrenner, R ^a   Reichl, H ^a  

^a FRAUNHOFER IZM   (Germany)

^b TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

^c SiemensVDO Automotive ^*

^d Division Powertrain   (Germany)

^e INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP TECHNOLOGY; MINIATURIZATION; PHASE FORMATION;

ASSEMBLY; GLOBAL POSITIONING SYSTEM; HIGH TEMPERATURE EFFECTS; INTERMETALLICS; MICROELECTRONICS; PHASE COMPOSITION;

FLIP CHIP DEVICES;

EID: 24644439659     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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