Underfilling flip chip packages with transfer molding technologies

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

Volumn , Issue , 2004, Pages 625-629

  Kooi, Chee Choong ^a   Yan, Chew Yin ^a   Rudge, V A ^a   Shing, Lim Szu ^a   Then, Edward ^a  

^a Intel Technology Malaysia Sdn Bhd   (Malaysia)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP DEVICES; INTEGRATED CIRCUIT TESTING; SHEET MOLDING COMPOUNDS;

MOLDED MATRIX ARRAY PACKAGES; MOLDED UNDERFILL (MUF);

ELECTRONICS PACKAGING;

EID: 28444456725     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

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