Thermal fatigue modelling for SnAgCu and SnPb solder joints

Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004

Volumn , Issue , 2004, Pages 557-564

  Dudek, Rainer ^a   Walter, Hans ^a   Doering, Ralf ^a   Michel, Bernd ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP; DEFORMATION; ELASTICITY; FATIGUE OF MATERIALS; HEAT LOSSES; MATHEMATICAL MODELS; METALLOGRAPHIC MICROSTRUCTURE; STRAIN; STRESS RELAXATION; STRESSES; THERMAL CYCLING; THERMAL EXPANSION;

COEFFICIENT OF THERMAL EXPANSION; CREEP STRAIN ENERGY DENSITY; DEFORMATION CONSTANTS; THERMAL FATIGUE;

SOLDERED JOINTS;

EID: 3843083910     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (17)

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