Temperature compensation method for resonant microsensors based on a controlled stiffness modulation

Journal of Applied Physics

Volumn 104, Issue 1, 2008, Pages

  Seo, Jae Hyeong ^a   Demirci, Kemal Safak ^a   Byun, Albert ^a   Truax, Stuart ^a   Brand, Oliver ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

LITHOGRAPHY; MICROSENSORS; MICROSTRUCTURE; RESONATORS; STIFFNESS;

AMERICAN INSTITUTE OF PHYSICS (AIP); AND DETECTION; COMPENSATION METHODS; COMPENSATION SCHEMES; FEED BACK LOOPS; FREQUENCY CHANGES; FREQUENCY DRIFTS; FREQUENCY FLUCTUATIONS; MICROMACHINED; RESONANT MICROSENSORS; TEMPERATURE CHANGING; TEMPERATURE COMPENSATIONS; TEMPERATURE-INDUCED;

MODULATION;

EID: 47749155219     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2952050     Document Type: Article

References (26)

1. D. Lange, C. Hagleitner, A. Hierlemann, O. Brand, and H. Baltes, Anal. Chem. 74, 3084 (2002).
2. J. H. Seo, L. Betancor, K. S. Demirci, A. Byun, J. Spain, and O. Brand, in Proc. Solid-State Sensors, Actuators and Microsystems Conference (Transducers 2007), 2007, 1737-1740.
3. N. V. Lavrik, M. J. Sepaniak, and P. G. Datskos, Rev. Sci. Instrum. 75, 2229 (2004).
4. R. Lucklum and P. Hauptmann, Anal. Bioanal. Chem. 384, 667 (2006).
5. F. L. Walls and J. J. Gagnepain, IEEE Trans. Ultrason. Ferroelectr. Freq. Control 39, 241 (1992).
6. R. Melamud, M. Hopcroft, C. Jha, K. Bongsang, S. Chandorkar, R. Candler, and T. W. Kenny, in Proc. Solid-State Sensors, Actuators and Microsystems Conference (Transducers 2005), 2005, pp. 392-395.
7. A. Nakladal, K. Sager, and G. Gerlach, Measurement 16, 21 (1995).
8. T. Thundat, G. Y. Chen, R. J. Warmack, D. P. Allison, and E. A. Wachter, Anal. Chem. 67, 519 (1995).
9. J.-H. Jeong, S.-H. Chung, S.-H. Lee, and D. Kwon, J. Microelectromech. Syst. 12, 524 (2003).
10. T. Thundat, R. J. Warmack, G. Y. Chen, and D. P. Allison, Appl. Phys. Lett. 64, 2894 (1994).
11. M. Koskenvuori, T. Mattila, A. Haara, J. Kiihamaki, I. Tittonen, A. Oja, and H. Seppa, Sens. Actuators A115, 23 (2004).
12. R. L. Filler and J. R. Vig, IEEE Trans. Ultrason. Ferroelectr. Freq. Control 40, 387 (1993).
13. B. Roith, A. Gollwitzer, A. Lerner, and G. Fischerauer, in Proc. IEEE International Frequency Control Symposium and Exposition, 2006, pp. 827-830.
14. T. W. Schneider, G. C. Frye-Mason, S. J. Martin, J. J. Spates, T. V. Bohuszewicz, G. C. Osbourn, and J. W. Bartholomew, Proc. SPIE 3539, 85 (1998).
15. J. H. Smith and S. D. Senturia, in Proc. Solid-State Sensors, Actuators and Microsystems Conference (Transducers 1995), 1995, pp. 724-727.
16. T. Ono, D. F. Wang, and M. Esashi, in Proceedings of the IEEE Sensors Conference 2003, pp. 825-829.
17. M. G. Schweyer, J. C. Andle, D. J. McAllister, and J. F. Vetelino, Sens. Actuators B35, 170 (1996).
18. J. Veris, Sens. Actuators, A 57, 179 (1996).
19. J. R. Vig, IEEE Sens. J. 1, 62 (2001).
20. E. P. Quevy and R. T. Howe, in Proceedings of the IEEE Radio Frequency Integrated Circuits (RFIC) Symposium, 2005, pp. 113-116.
21. C. Seungkeun, K. Seong-Hyok, Y. Yong-Kyu, and M. G. Allen, IEEE Trans. Magn. 42, 3506 (2006).
22. R. Sunier, T. Vancura, Y. Li, K.-U. Kirstein, H. Baltes, and O. Brand, J. Microelectromech. Syst. 15, 1098 (2006).
23. M. A. Hopcroft, M. Agarwal, K. K. Park, B. Kim, C. M. Jha, R. N. Candler, G. Yama, B. Murmann, and T. W. Kenny, in Proceedings of the IEEE Conference on Microelectromechanical Systems, 2006, pp. 222-225.
24. J. H. Seo and O. Brand, J. Microelectromech. Syst. 17, 483 (2008).
25. J. Thurn and R. F. Cook, J. Appl. Phys. 91, 1988 (2002).
26. J. A. Chiou and S. Chen, J. Microelectromech. Syst. 14, 782 (2005).