Effects of stress on the temperature coefficient of frequency in double clamped resonators

Digest of Technical Papers - International Conference on Solid State Sensors and Actuators and Microsystems, TRANSDUCERS '05

Volumn 1, Issue , 2005, Pages 392-395

  Melamud, Renata ^a   Hopcroft, Matt ^a   Jha, Chandra ^a   Kim, Bongsang ^a   Chandorkar, Saurabh ^a   Candler, Rob ^a   Kenny, Thomas W ^a  

^a STANFORD UNIVERSITY   (United States)

Author keywords

Hermetic Packaging; Resonator; Temperature Coefficient of Frequency

Indexed keywords

DIE PACKAGING; HERMETIC PACKAGING; TEMPERATURE COEFFICIENT OF FREQUENCY (TCF); THERMAL FREQUENCY STABILITY;

ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; NATURAL FREQUENCIES; THERMAL EFFECTS; THERMODYNAMIC STABILITY; THIN FILMS;

RESONATORS;

EID: 27544433542     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2005.1496438     Document Type: Conference Paper

References (6)

1. Hopcroft, M., et al. Active Temperature Compensation for Micromechanical Resonators. Hilton Head MEMS Workshop, 2004. Hilton Head, SC USA.
2. Hsu, W.-T. and C.T.-C. Nguyen. Stiffness-compensated temperature- insensitive micromechanical resonators. MEMS 2002.
3. Hsu, W.-T. and C.T.-C. Nguyen. Geometric Stress Compensation for Enhanced Thermal Stability in Micromechanical Resonators. IEEE Ultrasonics Symposium 1998.
4. Gorman, D.J., Free vibration analysis of beams and shafts. 1975.
5. Madou, M.J., Fundamentals of Microfabrication. 2001.
6. Nguyen, C.T., Micromechanical Signal Processors, PhD thesis, University of California at Berkeley, 1994