Temperature compensation of a MEMS resonator using quality factor as a thermometer

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn 2006, Issue , 2006, Pages 222-225

  Hopcroft, M A ^a   Agarwal, M ^a   Park, K K ^a   Kim, B ^a   Jha, C M ^a   Candler, R N ^a   Yama, G ^b   Murmann, B ^a   Kenny, T W ^a  

^a STANFORD UNIVERSITY   (United States)

^b BOSCH RESEARCH AND TECHNOLOGY CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

HIGH FREQUENCY SIGNAL APPLICATIONS; MEMS RESONATOR; SI THERMISTORS; TEMPERATURE COMPENSATION;

HIGH FREQUENCY TELECOMMUNICATION LINES; MICROELECTROMECHANICAL DEVICES; NATURAL FREQUENCIES; Q FACTOR MEASUREMENT; SILICON; TEMPERATURE MEASUREMENT; THERMOMETERS;

RESONATORS;

EID: 33750140685     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

1. Candler, R.N., et al., Single wafer encapsulation of MEMS devices. IEEE Transactions on Advanced Packaging, 26(3), 2003.
2. Partridge, A., et al. New thin film epitaxial polysilicon encapsulation for piezoresistive accelerometers. at MEMS '01, 2001. Interlaken, Switzerland.
3. Candler, R.N., et al. Hydrogen diffusion and pressure control of encapsulated MEMS resonators, at TRANSDUCERS '05, 2005.
4. Vig, J.R., Quartz Crystal Resonators and Oscillators for Frequency Control and Timing Applications - A Tutorial, 2005.
5. Kim, B., et al. Frequency stability of wafer-scale encapsulated MEMS resonators, at TRANSDUCERS '05, 2005.
6. Kim, B., et al. Temperature Dependence of Quality Factor in MEMS Resonators, at MEMS '06, 2006. Istanbul, Turkey.
7. Candler, R.N., et al. Impact of slot location on thermoelastic dissipation in micromechanical resonators, at TRANSDUCERS '05, 2005.
8. Omega Engineering Inc., F3105 Thin Film RTD Elements, 2005.
9. Candler, R.N., et al. Investigation of Energy Loss Mechanisms in Micromechanical Resonators. at TRANSDUCERS '03, 2003. Boston, MA USA.