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Applied Physics A: Materials Science and Processing

Volumn 77, Issue 2, 2003, Pages 237-242

Ablation and cutting of planar silicon devices using femtosecond laser pulses

(4) Barsch N a Korber K a Ostendorf, A a Tonshoff K H a

a LASER ZENTRUM HANNOVER E V (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CUTTING; ELECTRONICS PACKAGING; LASER ABLATION; LIGHT ABSORPTION; LIGHT POLARIZATION; MICROOPTICS; MULTICHIP MODULES; PHYSICAL PROPERTIES; SEMICONDUCTOR DEVICES; SILICON WAFERS; SURFACE ROUGHNESS; ULTRAFAST PHENOMENA;

BEAM POLARIZATION; BEAM SHAPING METHODS; FEMTOSECOND LASER PULSES; LINEAR FOCUS SHAPES; MICROSYSTEMS; PACKAGE DENSITIES; PLANAR SILICON DEVICES; SPOT FOCUS; ULTRAFAST LASER RADIATION;

LASER PULSES;

EID: 0037670796 PISSN: 09478396 EISSN: None Source Type: Journal
DOI: 10.1007/s00339-003-2118-4 Document Type: Article

Times cited : (138)

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