Deformation and fatigue behaviour of AuSn interconnects

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2006, Pages 297-301

  Wittler, Olaf ^a,c   Walter, Hans ^b   Dudek, Rainer ^c   Faust, Wolfgang ^c   Jun, Wei ^d   Michel, Bernd ^c  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

^b AMIC Angewandte Micro Messtechnik GmbH   (Germany)

^c FRAUNHOFER IZM   (Germany)

^d SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

DEFORMATION; ELASTICITY; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; EUTECTICS; FAILURE ANALYSIS; FATIGUE DAMAGE; FRACTURE FIXATION; QUALITY ASSURANCE; SOLDERED JOINTS; STRESSES; TECHNOLOGY; TIN ALLOYS;

FATIGUE BEHAVIOUR; FINE PITCH; FLIP-CHIP INTERCONNECTS; LAP-SHEAR; LAP-SHEAR SPECIMENS; MATE RIAL PROPERTIES; MECHANICAL LOADS; MECHANICAL SIMULATIONS; PACKAGING TECHNOLOGIES; PRODUCT LIFE; QUANTITATIVE ANALYSIS; RELIABILITY PROBLEMS; SET-UPS;

RELIABILITY;

EID: 37149039417     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2006.342732     Document Type: Conference Paper

References (15)

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