Characterization of sputtered tungsten nitride film and its application to Cu electroless plating

Microelectronic Engineering

Volumn 85, Issue 2, 2008, Pages 395-400

  Wang, Zenglin ^a   Liu, Zonghuai ^a   Yang, Zupei ^a   Shingubara, Shoso ^b  

^a SHAANXI NORMAL UNIVERSITY   (China)

^b KANSAI UNIVERSITY   (Japan)

Author keywords

Cu plating; Electroless; Reactive sputtering; WN barrier layer; XPS

Indexed keywords

COPPER; ELECTROLESS PLATING; NITRIDES; OPTICAL DESIGN; SPUTTER DEPOSITION; TUNGSTEN; TUNGSTEN COMPOUNDS; TUNGSTEN PLATING;

ELECTROLESS; TUNGSTEN NITRIDE (WN); TUNGSTEN NITRIDE FILMS;

REACTIVE SPUTTERING;

EID: 47049127427     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2007.07.017     Document Type: Article

References (23)

1. H Chao J.S., Kang H., Wong S.S., and Shacham-Diamand Y. MRS Bull. 18 (1993) 31
2. Kim J.J., Kim S.K., and Kim Y.S. J. Electrochem. Soc. 151 1 (2004) C97
3. Shacham-Diamand Y. Electrochem. Solid-state Lett. 3 6 (2000) 279
4. Wang Z., Ida T., Sakaue H., Shingubara S., and Takahagi T. Electrochem. Solid-State Lett. 6 3 (2003) C38
5. Wang Z., Sakaue H., Shingubara S., and Takahagi T. Jpn. J. Appl. Phys. 42 4B (2003) 1843
6. Wang Z., Yaegashi O., Sakaue H., Shingubara S., and Takahagi T. J. Appl. Phys. 97 7 (2003) 4697
7. Kim Y.S., Bae D.L., Yang H., Shin H.S., Wang G.W., Senkevich J.J., and Lu T.M. J. Electrochem. Soc. 152 2 (2005) C89
8. Bchir O.J., Kim K.C., Anderson T.J., Craciun V., Brooks B.C., and McElwee-White L. J . Electrochem. Soc. 151 10 (2004) G697
9. Sim H.S., Kim S.I., Jeon H., and Kim Y.T. Jpn. J. Appl. Phys. 42 (2003) 6359
10. Lai K.K., Mak A.W., Wendling T.P.H.F., Jian P., and Hathcock B. Thin Solid Film 332 (1998) 329
11. Meunier C., Monteil C., Savall C., Palmino F., Weber J., Berjoan R., and Durand J. Appl. Surf. Sci. 125 (1998) 313
12. Guruvenket S., and Mohan Rao G. Mater. Sci. Eng. B106 (2004) 172
13. Shen Y.G., Mai Y.W., McKenzie D.R., Zhang Q.C., McFall W.D., and McBride W.E. J. Appl. Phys. 88 3 (2000) 1380
14. LEE K.S. Jpn. J. Appl. Phys. 42 3 (2003) 3368
15. Ganguli S., Chen L., Levine T., Zheng B., and Chang M. J. Vac. Sci. Technol. B 18 1 (2000) 237
16. Shen Y.G., and Mai Y.W. Surf. Coat. Technol. 127 (2000) 239
17. Shen Y.G., and Mai Y.W. Mater. Sci. Eng. B76 (2000) 10
18. Baker C.C., and Shah S.I. J. Vac. Sci. Technol. A 20 5 (2002) 1699
19. Jiang P.C., Chen J.S., and Lin Y.K. J. Vac. Sci. Technol. A 21 3 (2003) 616
20. Shen Y.G., Mai Y.W., McBride W.E., Zhang Q.C., and McKenzie D.R. Thin Solid Film 372 (2000) 257
21. Chastain J. In: Chastain J. (Ed). Handbook of X-ray Photoelectron Spectroscopy (1992), Perkin-Elmer Corporation, Physical Electronics Division, Eden Prairie, MN 170
22. Chiu H.T., and Chuang S.H. J. Mater. Res. 8 (1993) 1353
23. Raider S.I., and Flitsh R. IBM J. Res. Dev. 22 (1978) 294