Effect of deposition conditions on internal stresses and microstructure of reactively sputtered tungsten nitride films

Surface and Coatings Technology

Volumn 127, Issue 2, 2000, Pages 239-246

  Shen, Y G ^a   Mai, Y W ^a  

^a UNIVERSITY OF SYDNEY   (Australia)

Author keywords

[No Author keywords available]

Indexed keywords

IONIC BONDING; TUNGSTEN NITRIDE;

ANNEALING; CRYSTAL MICROSTRUCTURE; CRYSTALLIZATION; ELECTRON ENERGY LOSS SPECTROSCOPY; GRAIN SIZE AND SHAPE; MAGNETRON SPUTTERING; RESIDUAL STRESSES; STOICHIOMETRY; TRANSMISSION ELECTRON MICROSCOPY; TUNGSTEN COMPOUNDS; X RAY DIFFRACTION ANALYSIS; X RAY PHOTOELECTRON SPECTROSCOPY;

THIN FILMS;

EID: 0033703599     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (20)