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Volumn 42, Issue 4 B, 2003, Pages 1843-1846

Influence of surface oxide of sputtered TaN on displacement plating of Cu

Author keywords

Displacement plating; Sputtered film; Surface oxidation; TaN film; XPS analysis and redox potentials

Indexed keywords

ARGON; COPPER; ELECTROLESS PLATING; NITROGEN; OXIDATION; PARTIAL PRESSURE; SPUTTERING; SURFACE CHEMISTRY; TANTALUM COMPOUNDS; THICKNESS MEASUREMENT; ULSI CIRCUITS; X RAY PHOTOELECTRON SPECTROSCOPY;

EID: 0037672208     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.42.1843     Document Type: Article
Times cited : (19)

References (16)
  • 15
    • 0003459529 scopus 로고
    • ed. J. Chastain (Perkin-Elmer Corporation, Physical Electronics Division, Eden Prairie, MN)
    • J. Chastain: Handbook of X-ray Photoelectron Spectroscopy, ed. J. Chastain (Perkin-Elmer Corporation, Physical Electronics Division, Eden Prairie, MN, 1992) p. 170.
    • (1992) Handbook of X-Ray Photoelectron Spectroscopy , pp. 170
    • Chastain, J.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.