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Volumn 42, Issue 4 B, 2003, Pages 1843-1846
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Influence of surface oxide of sputtered TaN on displacement plating of Cu
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Author keywords
Displacement plating; Sputtered film; Surface oxidation; TaN film; XPS analysis and redox potentials
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Indexed keywords
ARGON;
COPPER;
ELECTROLESS PLATING;
NITROGEN;
OXIDATION;
PARTIAL PRESSURE;
SPUTTERING;
SURFACE CHEMISTRY;
TANTALUM COMPOUNDS;
THICKNESS MEASUREMENT;
ULSI CIRCUITS;
X RAY PHOTOELECTRON SPECTROSCOPY;
SURFACE OXIDATION;
SURFACE OXIDE LAYER;
TANTALUM NITRIDE FILM;
THIN FILMS;
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EID: 0037672208
PISSN: 00214922
EISSN: None
Source Type: Journal
DOI: 10.1143/jjap.42.1843 Document Type: Article |
Times cited : (19)
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References (16)
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