Effects of postbake on the microstructure and whisker growth of matte Sn finish

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 2008, Pages 158-164

  Yu, C H ^a   Kang, H S ^a   Kim, K S ^b   Han, S W ^c   Yang, K C ^c  

^a Electronics and Telecommunications Research Institute (ETRI)   (South Korea)

^b Yeojoo Institute of Technology   (South Korea)

^c Chung Ang University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTAL ORIENTATION; CRYSTAL WHISKERS; PLATING; TIN;

LARGE-GRAIN LAYERS; POSTBAKE TREATMENT;

MICROSTRUCTURE;

EID: 44449088005     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.2007.4419936     Document Type: Conference Paper

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